Designed for protection of metal parts during electroplating and chemical treatment processes

Inner layer with special hot-melt adhesive effectively prevents electrolyte penetration and corrosion of metal surfaces

Suitable for partial shielding and isolation of plating liquids on metal conductors, electrical contacts, or high-precision components

Operating temperature : -50℃ ~ 125℃
 

Highshrinkage ratio  3：1  ,  4：1 

Easy-to-remove design after processing without affecting conductivity or subsequent assembly

Meet RoHS requirement

Minimum fully recovery temperature : 80˚C～110˚C

Also available in 4:1 and 6:1 high shrink ratio versions